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Advanced Metallization Conference 2005 (AMC 2005): Volume 21
Engelsk Hardback
Advanced Metallization Conference 2005 (AMC 2005): Volume 21
Engelsk Hardback

339 kr
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Om denne bog
Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.
Product detaljer
Sprog:
Engelsk
Sider:
782
ISBN-13:
9781558998650
Indbinding:
Hardback
Udgave:
ISBN-10:
1558998659
Udg. Dato:
1 jan 2006
Længde:
44mm
Bredde:
160mm
Højde:
235mm
Forlag:
Materials Research Society
Oplagsdato:
1 jan 2006
Forfatter(e):
Kategori sammenhænge