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Modeling and Simulation for Microelectronic Packaging Assembly

- Manufacturing, Reliability and Testing
Af: Shen Liu, Yong Liu Engelsk Hardback

Modeling and Simulation for Microelectronic Packaging Assembly

- Manufacturing, Reliability and Testing
Af: Shen Liu, Yong Liu Engelsk Hardback
Tjek vores konkurrenters priser
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
Tjek vores konkurrenters priser
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kr 1.097
Fragt: 39 kr
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20 kr
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Tjek vores konkurrenters priser
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
Produktdetaljer
Sprog: Engelsk
Sider: 576
ISBN-13: 9780470827802
Indbinding: Hardback
Udgave:
ISBN-10: 0470827807
Kategori: Produktionsteknik
Udg. Dato: 21 okt 2011
Længde: 36mm
Bredde: 175mm
Højde: 252mm
Forlag: John Wiley & Sons Inc
Oplagsdato: 21 okt 2011
Forfatter(e): Shen Liu, Yong Liu
Forfatter(e) Shen Liu, Yong Liu


Kategori Produktionsteknik


ISBN-13 9780470827802


Sprog Engelsk


Indbinding Hardback


Sider 576


Udgave


Længde 36mm


Bredde 175mm


Højde 252mm


Udg. Dato 21 okt 2011


Oplagsdato 21 okt 2011


Forlag John Wiley & Sons Inc

Kategori sammenhænge