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3D Interconnect Architectures for Heterogeneous Technologies
- Modeling and Optimization
Engelsk Hardback
3D Interconnect Architectures for Heterogeneous Technologies
- Modeling and Optimization
Engelsk Hardback

1.002 kr
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Om denne bog
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
Product detaljer
Sprog:
Engelsk
Sider:
395
ISBN-13:
9783030982287
Indbinding:
Hardback
Udgave:
ISBN-10:
3030982289
Udg. Dato:
28 jun 2022
Længde:
0mm
Bredde:
155mm
Højde:
235mm
Forlag:
Springer Nature Switzerland AG
Oplagsdato:
28 jun 2022
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