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3D Integration of Resistive Switching Memory

Engelsk Paperback

3D Integration of Resistive Switching Memory

Engelsk Paperback
Tjek vores konkurrenters priser

This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications.
 
Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:


1: Associative Problems in Crossbar array and 3D architectures;
2: Selector Devices and Self-Selective Cells;
3: Integration of 3D RRAM;
4: Reliability Issues in 3D RRAM;
5: Applications of 3D RRAM beyond Storage.

The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.

Tjek vores konkurrenters priser
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Tjek vores konkurrenters priser

This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications.
 
Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:


1: Associative Problems in Crossbar array and 3D architectures;
2: Selector Devices and Self-Selective Cells;
3: Integration of 3D RRAM;
4: Reliability Issues in 3D RRAM;
5: Applications of 3D RRAM beyond Storage.

The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.

Produktdetaljer
Sprog: Engelsk
Sider: 98
ISBN-13: 9781032489506
Indbinding: Paperback
Udgave:
ISBN-10: 1032489502
Kategori: Elektroteknik
Udg. Dato: 19 dec 2024
Længde: 11mm
Bredde: 216mm
Højde: 138mm
Forlag: Taylor & Francis Ltd
Oplagsdato: 19 dec 2024
Forfatter(e):
Forfatter(e)


Kategori Elektroteknik


ISBN-13 9781032489506


Sprog Engelsk


Indbinding Paperback


Sider 98


Udgave


Længde 11mm


Bredde 216mm


Højde 138mm


Udg. Dato 19 dec 2024


Oplagsdato 19 dec 2024


Forlag Taylor & Francis Ltd

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